Intel's upcoming 11th-Gen desktop CPU's will have a ~10% IPC increase according to "rogame" from Hardwareleaks 📦

5    26 Jul 2020 18:08 by u/None

Rocket Lake-S is expected to launch in Q4 2020 or Q1 2021. It will be the first Intel desktop CPU to feature PCI-e 4.0 support. It is based on the LGA 1200 socket and is compatible with some of the existing 10th-gen motherboards. Rocket Lake-S features an entirely new architecture, finally replacing the ageing Skylake architecture. It is manufactured on Intel's 14nm process, likely the last generation to be made on this process before Intel moves to their 10nm node with Alder Lake. Rocket Lake-S will also feature Intel's new Xe graphics. [More information on Rocket Lake-S](https://cdn.videocardz.com/1/2020/03/Intel-Rocket-Lake-S-VideoCardz.jpg) (courtesy of Videocardz.com)

4 comments

1
I can't believe they're still on 14nm.
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Keep in mind that all tech companies use different measurements, there is no global standard. TSMC 7nm is not twice as good as Intel 14nm, despite what the naming suggests. Another example is Intel 10nm which has a transistor density equal to the 7nm EUV node from TSMC, which is the best 7nm node they have (and much better than the 7nm AMD is currently using for Zen 2). Zen 3 will likely be 7nm+ (EUV) so that puts it on par with Intel 10nm, though Intel won't release 10nm desktop CPU's until the second half of 2021, nearly a year later than AMD. If you really want to know how good a certain process is relative to another, compare their transistor densities (transistors per mm2).
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Of course, this was less of an "AMD are doing better" comment and more of a "wow, their usual die shrink cycle is just dead in the water".
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It’s worth mentioning that Intel has the 14nm process extremely well optimized for what it is. Not to mention that it is decently efficient with this new model series where they changed the size of the thickness of the die and increased the heat spreader. They are doing well enough to stay where they are right now.